How a Dual Curing Adhesive Works

This sponsored short article is introduced to you by MasterBond.

Master Bond UV22DC80-1 is a nanosilica filled, twin heal epoxy dependent technique. Nanosilica filled epoxy formulations are intended to even further make improvements to efficiency and processing qualities.

The specific filler will perform a very important position in determining critical parameters this sort of as viscosity, movement, getting old attributes, power, shrinkage, hardness, and exotherm. As a twin curing procedure, UV22DC80-1 cures quickly on exposure to UV light, and will cross hyperlink in shadowed out places when heat is included.

See Master Bond’s UV22DC80-1 in Motion

Dual remedy methods are efficient for quickly repairing pieces with the UV part of the remedy, and then concluding the process by including warmth. Enjoy this movie to see a dual healed epoxy in motion.

This compound features extremely very low shrinkage on heal, outstanding dimensional balance, and resists abrasion. It is not oxygen inhibited. It withstands chemical substances these as acids, bases, fuels and solvents. It is electrically insulative with a quantity resistivity larger than 1014 ohm-cm. It is optically distinct, with a refractive index of 1.52.

The reduced viscosity ranges from 500 cps to 3500 cps. The temperature serviceability extends from -100°F to 300°F. UV22DC80-1 bonds very well to metals, ceramics, glass, rubber, and lots of plastics. It passes NASA reduced outgassing certification and is used in large tech applications including aerospace, optical and opto-electronics.

Speak to Grasp Bond to request a technical data sheet or focus on your software.

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